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Precision Polishing Agents to Support Big Data Storage in the IoT Era

Precision Industry/Electronics

We are approaching an era in which objects of all kinds will send and receive data via the so-called Internet of Things (IoT). Already such advances as self-driving automobiles and smart factories are dramatically increasing the volume of digital data sent and received around the world. The "big data" thus generated is collected at data centers, where it is stored on such devices as hard disk drives (HDDs) and solid-state drives (SSDs). Kao has been doing its part to enhance the performance of these critically important storage devices by developing precision polishing agents for electronic substrates.

Building on essential research into the complexities of polishing at the molecular and atomic level, Kao has been focusing on two core polishing technologies:

  1. chemical mechanical polishing (CMP)
  2. high-speed planarization (HSP).

Kao's original CMP technology is based on control of chemical reactions that take place on the substrate surface at the sub-nanoscale level and precision particle-size distribution design to maximize the number of abrasive grains acting on the surface. HSP aims for the ideal of selective polishing that targets surface convexities with the help of our original planarizing agent-a specially designed polymer that detaches from the slurry's abrasive particles only under high polishing load (at convexities) to accelerate the polishing rate.

Customers around the world welcome products that support unsurpassed quality in electronic substrate finishing without sacrificing productivity. We will continue to contribute to the development of a sustainable information society through products rooted in a scientific understanding of complex interfacial phenomena.

Core Technology 1 : Chemical Mechanical Polishing (CMP)

Core Technology 2 : High-Speed Planarization (HSP)

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